| No. | project | Processing capacity | explain |
| 1 | Maximum number of floors | 40 | The highest number of layers exceeds the batch processing capacity of science and technology 4-24 layers sample processing capacity 6-40 layers |
| 2 | Maximum size | 550x560mm | Chaosheng technology is only allowed to accept within 500x500mm temporarily. Please contact customer service for special circumstances |
| 3 | Minimum line width and line spacing | 2.5/2.5mil | 3 / 3mil (1 oz of finished copper thickness), 4 / 4mil (1.5oz of finished copper thickness), 5 / 5MIL (2 oz of finished copper thickness), push is allowed under the condition It is recommended to increase the line width and distance |
| 4 | Minimum hole diameter (machine drill) | 0.15mm | The minimum hole diameter of mechanical drilling is 0.15mm, and the recommended design is 0.2mm or more if the conditions permit |
| 5 | Bore tolerance (machine drill) | ±0.07mm | The tolerance of mechanical drilling is ± 0.07mm |
| 6 | Through hole single side welding ring | 2mil | The minimum Via is 2mil, and the minimum device hole is 4mil |
| 7 | Effective line bridge | 6mil | Refers to the connecting line width of two copper sheets in the line |
| 8 | Copper thickness of finished outer layer | 35--140um | Refers to the thickness of the copper foil of the outer circuit of the finished circuit boardRefers to the thickness of the copper foil of the outer circuit of the finished circuit board |
| 9 | 成品內層銅厚 | 17-70um | Copper thickness of finished inner layer |
| 10 | Type of resistance welding | Photosensitive ink | White, black, blue, green, yellow, red, etc |
| 11 | Minimum character width | ≥0.13mm | The minimum width of characters. If it is less than 0.13MM, the physical board may cause unclear characters due to design reasons |
| 12 | Minimum character height | ≥0.8mm | The minimum height of characters. If it is less than 0.8mm, the characters of the physical board may not be clear due to design reasons |
| 13 | Character aspect ratio | 01:06 | The most appropriate ratio of width to height is more conducive to production |
| 14 | surface treatment | Tin spraying, lead-free tin spraying, gold deposition, silver deposition, OSP, gold finger, selective gold deposition, electrodeposition, Hal | |
| 15 | Plate thickness range | 0.2--3.0mm | At present, the conventional plate thickness produced by Chaosheng technology is 0.2/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.5/3.0mm, and the maximum plate thickness in large batch can be processed to 3.0. If the plate thickness is greater than 3.0mm, customer service shall be informed 7 days in advance |
| 16 | Plate thickness tolerance | ± 10% | Thickness tolerance of circuit board |
| 17 | Minimum slot cutter | 0.65mm | The minimum width of copper groove in the plate is 0.65mm, without gongs groove 0.8 |
| 18 | Distance between route and profile | ≥0.25mm（10mil） | For the delivery of gongs and boards, the distance between the wiring of the line layer and the board outline line shall not be less than 0.25mm; for the delivery of V-CUT panels, the distance between the wiring and the V-CUT center line shall not be less than 0.4mm, the length of the V-CUT parallel direction shall not be less than 60mm, and the maximum V-CUT dimension shall be 350mm (non V-CUT direction) |
| 19 | Half hole process minimum half hole diameter | 0.3mm | The half hole process is a special process, and the minimum hole diameter shall not be less than 0.3mm |
| 20 | Mosaic: no gap | 0mmGap splicing | It is a mosaic shipment. The gap between the intermediate plate and the plate is 0 |
| 21 | Mosaic: with gaps | 1.6mm | The gap of mosaic with gap shall not be less than 1.6mm, otherwise it is difficult to make gongs |
| 22 | Peel strength | ≥2.0N/cm | |
| 23 | Flame retardant | 94V-0 | |
| 24 | Impedance control tolerance | 土10% | |
| 25 | Solder bridge | ≥4mil | |
| 26 | PadsCopper laying method of manufacturer | Hatch copper laying | The manufacturer uses reduction laying copper, please pay attention to this pad design customer |
| 27 | Groove drawing in pads software | Using the drill drawing layer | If there are many nonmetallic grooves on the board, please draw them on the drill drawing layer |
| 28 | Protel/dxpWindow layer in software | Solder layer | A few engineers mistakenly put it into the paste layer, and Chaosheng electronics does not deal with the paste layer |
| 29 | Protel/dxp Profile layer | Use keepout layer or mechanical layer | Please note: only one profile layer is allowed in a file, and two profiles layers are not allowed to exist at the same time. Please delete the unused profile layer, i.e. when drawing a profile, only one of the keepout layer or the mechanical layer can be selected |
| 30 | Sheet type | FR-4, Rogers, PTFE, aluminum substrate, etc |